3D chip stack, IBM research. Cooling test vehicle being developed at the 3D chip-stacking project at IBM Research-Zurich, Switzerland. A sugar cube is used for size comparison. This research involves the use of liquid cooling for 3D chip stacks, a potential method to boost performance and energy efficiency. It is thought that by 2025, chip stacks with embedded liquid cooling, communications in three dimensions, and minimal power consumption will shrink supercomputers to the size of a desktop computer. Photographed in November 2010.